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LP062.6B Ball Grinding And Polishing Machine

LP062.6B Ball Grinding And Polishing Machine

Mainly used for grinding and polishing high precision optical glass, quartz wafer, ceramics, silicon wafer, sapphire and other planar elements
Therc are two kinds of grinding disks: one is granite millstone, which is suitable for grinding and polishing becausc of itsminimal deformation under different ambient temperature changes. The other is cast iron milstone, which is suitable for fine grinding, six processing stations

Product details

LP062.6B Ball Grinding And Polishing Machine

Mainly used for grinding and polishing high precision optical glass, quartz wafer, ceramics, silicon wafer, sapphire and other planar elements

Therc are two kinds of grinding disks: one is granite millstone, which is suitable for grinding and polishing becausc of itsminimal deformation under different ambient temperature changes. The other is cast iron milstone, which is suitable for fine grinding, six processing stations.

Main technical specification

Product Model

LP062.6B

Millstone size

Ф620 mm

Workpiece ring size

Ф170×Ф145×100

Jumpiness of single point

Jumpiness of millstone

≤0.0Imm

≤0.05mm

Location number

6pcs

Millstone rotating speed

0,20 - 90RPM

Processing scope

≤Ф145mm

Total power3kW/380V
WeightAbout800kg
Size1060x1120x1400(mm)

All machine can be designed   and manufactured as required.


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